In a major boost to India’s semiconductor ambitions, Prime Minister Narendra Modi is set to virtually lay the foundation stone for a cutting-edge chip manufacturing facility in Uttar Pradesh’s Jewar region on Saturday. This landmark project, a joint venture between HCL Group and Taiwan’s Foxconn, underscores the nation’s push to become a global hub for high-tech electronics.
The Rs 3,700 crore initiative, developed under India Chip Private Limited, will be established in the Yamuna Expressway Industrial Development Authority (YEIDA) area, just beside the upcoming Noida International Airport. YEIDA has allocated nearly 48 acres in Sector-28 for this state-of-the-art plant.
Specializing in Outsourced Semiconductor Assembly and Test (OSAT) operations, the facility will focus on producing Display Driver Integrated Circuits (DDICs). These essential chips power a wide array of devices, from smartphones and tablets to laptops, automobiles, and consumer electronics, addressing a critical gap in India’s tech supply chain.
Backed by the Modified Semiconductor Assembly, Testing, Marking, and Packaging (ATMP) scheme, the project aims to bolster domestic manufacturing, reduce import dependency, and fortify global supply chains. Foxconn holds a 40% stake, having already invested $37.2 million (about Rs 312 crore), with potential to scale up to Rs 424 crore.
This venture is poised to supercharge India’s semiconductor ecosystem, fostering technological innovation and skill development. Thousands of direct and indirect jobs for engineers, technicians, and professionals are expected, propelling economic growth in the region. As PM Modi inaugurates this via video conferencing, it signals a new era of self-reliance in semiconductors.